The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).

 
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> Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

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