There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): ##STR00001## wherein R.sup.1 represents ##STR00002## and R.sup.2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.