When a wafer is moved from a first position to a second position along a path where alignment marks pass through an alignment detection system, wafer table is to be moved along a path whose standstill time of a Y linear motor, which drives the wafer table in the Y-axis direction, and an X linear motor, which drives the wafer table in the X-axis direction orthogonal to the Y-axis direction, is minimum. In this case, the time for both linear motors to drive the wafer table simultaneously is increased as much as possible, and during such simultaneous drive, the movement distance of the wafer can be increased compared with the case when the wafer table is driven using only one of the linear motors. As a result, the time required to move wafer from the first position to the second position can be reduced.