The present invention provides a process for decreasing the resistivity of a non-machined conductive flow field plate for use in a fuel cell. The process includes the step of annealing the conductive flow field plate by heating the conductive flow field plate to a temperature between 25.degree. C. (room temperature) and a temperature slightly lower than the material softening temperature of the material composition of the conductive flow field plate; maintaining the conductive flow field plate at that temperature for an effective period of time; and, cooling the conductive flow field plate to room temperature.