An optical element module package with a TO-can structure is disclosed. The module includes a laser diode for projecting optical signals and a photo diode for monitoring the optical signals projected from the laser diode. The package includes a stem having a first through-hole formed in a long-hole shape parallel to the diametrical direction of the stem, the first through-hole extending through the stem from one side to the other; and a plurality of leads arranged in a row through the first through-hole. The first through-hole is filled with a sealant of a glass material so that the stem and the leads are fixed.

 
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> Semiconductor laser module and method of manufacturing the same

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