A multi-chip package includes a substrate having first bonding pads and
second bonding pads, a first chip having chip pads on an active surface,
spacers attached to the substrate between the first bonding pads and the
second bonding pads and having a greater thickness than that of the first
chip, a second chip having chip pads on an active surface, first bonding
wires, second bonding wires, external connection terminals positioned on
the bottom surface of the substrate, and a package body. The first chip
and the second chip are any pad types. The first and second chips may
have chip pads on four edges of the active surfaces or on two opposite
edges of the active surfaces. The first bonding wires and the second
bonding wires are bonded to the corresponding chip pads and the
corresponding first and second bonding pads by the reverse bonding
method. The spacer is made of one elected from the group consisting of
metal, elastomer, epoxy, and photo sensitive resist. The spacer may be
discontinuously formed about a perimeter of the first chip. The
multi-chip package of the present invention may further comprise a third
chip mounted on the second chip.