Embodiments of stiffening members in accordance with the present invention
provide a mechanical support that is wave soldered to the frontside of
the system substrate simultaneously with other wave soldered components.
The stiffening member comprises a flat plate with a plurality of mounting
pins. The number of mounting pins are predetermined to provide the plate
with sufficient support to resist expected loading conditions when wave
soldered in plated through holes on a system substrate. The mounting pins
are adapted for insertion into plated through holes on the system
substrate. The length of the mounting pins are predetermined to account
for the height of the SMT component upon which it is attached, the
thickness of the system substrate, and the desired amount of mounting pin
protrusion from the backside of the system substrate. The stiffening
members consume very little system substrate space while retaining a
platform for heat dissipation.