Apparatus and method for adhesively attaching a first member to a second member, such as components of a data storage device. Preferably, an adhesive is applied to the first member and exposed to ultraviolet light. The second member is placed onto the adhesive, and heat is applied to finalize curing. The adhesive is subsequently cooled to a temperature below a glass transition temperature (Tg) of the adhesive to detach the first and second members. Respective mating surfaces of the first and second members are preferably provided with different adhesive coupling characteristics, such as by provision of a surface adhesive promotor or a micro-texturized pattern to only one member. In this way, upon detachment of the first and second members, substantially all of the adhesive is removed from the other member. A filler material further establishes adhesive thickness and enhances structural unity of the adhesive during detachment of the respective members.

 
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> Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects

~ 00316