A cooling system for dissipating heat from a component is disclosed. The
cooling system includes a cooling device that includes a core and a
plurality of spaced apart fins connected with the core with each fin
including at least two vanes. A trailing edge of the fins define a
chamber. A fan mount is connected with the vanes and supports a stator of
a fan. A rotor connected with the stator includes a plurality of fan
blades and the fan mount positions the stator over the chamber with the
fan blades submerged in the chamber. A height of the cooling system is
reduced because the fan does not include a housing and a substantial
portion of the fan is positioned in the chamber. The submerged position
of the fan blades allows for a high fan capacity with reduce air shock
noise.