A cooling system for dissipating heat from a component is disclosed. The cooling system includes a cooling device that includes a core and a plurality of spaced apart fins connected with the core with each fin including at least two vanes. A trailing edge of the fins define a chamber. A fan mount is connected with the vanes and supports a stator of a fan. A rotor connected with the stator includes a plurality of fan blades and the fan mount positions the stator over the chamber with the fan blades submerged in the chamber. A height of the cooling system is reduced because the fan does not include a housing and a substantial portion of the fan is positioned in the chamber. The submerged position of the fan blades allows for a high fan capacity with reduce air shock noise.