A method and apparatus for generating and controlling a plasma (130) formed in a capacitively coupled plasma system (100) having a plasma electrode (140) and a bias electrode in the form of a workpiece support member (170), wherein the plasma electrode is unitary and has multiple regions (R.sub.i) defined by a plurality of RF power feed lines (156) and the RF power delivered thereto. The electrode regions may also be defined as electrode segments (420) separated by insulators (426). A set of process parameters A={n, .tau..sub.i, .PHI..sub.i, P.sub.i, S; L.sub.i} is defined; wherein n is the number of RF feed lines connected to the electrode upper surface at locations L.sub.i, .tau..sub.i is the on-time of the RF power for the i.sup.th RF feed line, .PHI..sub.i is the phase of the i.sup.th RF feed line relative to a select one of the other RF feed lines, P.sub.i is the RF power delivered to the electrode through the i.sup.th RF feed line at location L.sub.i, and S is the sequencing of RF power to the electrode through the RF feed lines. One or more of these parameters are adjusted so that operation of the plasma system results in a workpiece (176) being processed with a desired amount or degree of process uniformity.

 
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> Method for fabricating optical devices by assembling multiple wafers containing planar optical waveguides

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