A process for curing a moldable compound under a plurality of curing
conditions by: (1) obtaining time dependent data streams of dielectric or
impedance values from a plurality of sensors distributed within a curing
mold, wherein the moldable compound is a dialectric for each of the
sensors; (2) determining impedance related measurements from the data
streams for the plurality of sensors; (3) determining predictive and/or
corrective curing actions for enhancing the curing process using the
impedance related measurements for the plurality of sensors; and (4)
controlling the mass production curing of parts to obtain cured parts
having one or more desired properties.