A module has a metallic mass with an upper surface having laterally spaced wiring channels and outwardly extending fins. A circuit board is mounted on the module and fabricated of an insulating bottom layer with trace patterns thereon. A plurality of electrical components, including at least one light emitting diode, are coupled to the trace patterns of the circuit board. A pair of continuous conductor wires couple the electrical components with each wire and extend through the wiring channels of the module. At least one pair of connectors extend through the circuit board with upper ends coupled with the trace patterns and lower ends extending downwardly to electrically couple with the wires.