Embodiments include a method for forming a head suspension assembly. A
spacer layer is formed in or on a silicon wafer. A transfer film
including an opening defining the shape of a slider support membrane is
provided, and the opening is filled with a resin material. The transfer
film with the resin material therein is positioned over the silicon wafer
so that at least a portion of the resin material is positioned adjacent
to the spacer layer. The resin material is baked to form a glassy carbon
material. The spacer layer is etched to form a trench in the silicon
wafer adjacent to the glassy carbon material, and a slider is positioned
on the glassy carbon material over the trench.