The arrangement and method for sputtering material onto a workpiece and cleaning a target of the sputtering chamber includes exposing a target to an electromagnetic field of a strength sufficient to remove particles from the target. The electromagnetic field is generated by an electromagnetic device that is positioned in proximity to the target and generates a strength greater than a strength of a cathode magnetic field behind the target to safely remove the contaminating particulates from the target, which may be made of a strong magnetic material.