An exposure apparatus includes an image sensing section and image sensing control section for measuring the average position of a mark formed on a wafer during a predetermined observation period before a stage completely stops, an interferometer for measuring any deviation of the stage during the observation period, a stage deviation storage section for storing the measurement result by the interferometer in a memory and calculating the average deviation of the stage on the basis of the measurement result, and a shift amount calculation section for calculating the actual position of the mark, while the stage is at rest, on the basis of the average position of the mark and the average deviation of the stage.