The invention provides molding compounds that are particularly suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article. These compounds are generally liquid thermosetting molding resins which comprise a thermoset resin matrix such as a terephthalate polyester which can include blends of polyester and/or vinyl ester with a significant loading of conductive inorganic filler, typically graphite. The compositions also include flame and sound retardant additives, and glass fibers. They are further formulated to meet the desired molding characteristics; to withstand the operating temperatures to which they will be exposed; and to have a predetermined strength and a desirable user interface including appearance, and odor. Typically, the compounds will have a glass transition temperature from about 160.degree. C. (320.degree. F.) to about 195.degree. C. (383.degree. F.).