The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency corresponding to a resonance frequency of the material; including a solution vibration in the deposition solution in a direction non-parallel to the material vibration, said solution vibration having a frequency corresponding to the a resonance frequency of the deposition solution, whereby said metal is deposited onto the material. This process results in deposition of metal from the plating bath on the material in a controlled and substantially uniform thickness.