In an example embodiment, the semiconductor device comprises a carrier and a semiconductor element, such as an integrated circuit. The carrier is provided with apertures, thereby defining connecting conductors having side faces. Notches are present in the side faces. The semiconductor element is enclosed in an encapsulation that extends into the notches in the carrier. As a result, the encapsulation is mechanically anchored in the carrier. The semiconductor device can be made in a process wherein, after the encapsulating step, no lithographic steps are necessary.