An athermal package for fiber photonic devices includes three portions of at least three materials, each having a coefficient of thermal expansion that is different from the other two. In contrast, a conventional athermal packages typically has only two materials. In a typical application, an optical fiber containing a photonic device is attached to the athermal package. The three materials of the athermal package are selected and the three portions as sized to optimize a thermal response of the package to that of the optical fiber.