Provided is a cup-shaped plating apparatus which can plate the whole area
of a plating target surface with a uniform film thickness. In a
cup-shaped plating apparatus including a placement portion of an object
to be plated which is provided at an opening end of a plating tank, means
for supplying a plating solution into the plating tank, a plating
solution outlet port which is formed in the plating tank, a cavity
portion into which the plating solution which has flown out of the outlet
port flows, a plating solution discharge port within the cavity portion,
and a collection tank for the plating solution discharged from the
discharge port, which subjects the object to be plated to plating
treatment while supplying the plating solution into the plating tank, the
shape and/or opening area of the discharge port formed on the downstream
side of the cavity portion can be changed. If the shape and/or opening
area of the discharge port formed on the downstream side of the cavity
portion can be adjusted, it is possible to suppress nonuniform plating
and variations in plating on a plating target surface by adjusting the
shape and/or opening area.