A multi feed-through pin electrical connector has a pin-count layout that corresponds to the form factor of the pin layout of a micro-size (e.g., nano-type) multipin connector, but contains only a relatively small number of feed-through pins, locations of which are those of selected pins of the micro-sized multipin connector. This allows adjacent pin locations of the relatively small pin-count layout to be spaced farther apart from each other than pin locations of conventional micro-sized multipin connectors, so that the available wire-connection surface areas of the interior ends of the feed-through pins may be substantially increased relative to those of conventional micro-sized multipin connectors, and thereby facilitate secure wire-bonding to the interior ends of the pins.