A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.