A method and apparatus for depositing a material layer onto a substrate is
described. The method includes delivering a mixture of precursors for the
material layer into a process chamber and depositing the material layer
on the substrate at low temperature. The material layer can be used as an
encapsulating layer for various display applications which require low
temperature deposition process due to thermal instability of underlying
materials used. In one aspect, the encapsulating layer includes one or
more material layers (multilayer) having one or more barrier layer
materials and one or more low-dielectric constant materials. The
encapsulating layer thus deposited provides reduced surface roughness,
improved water-barrier performance, reduce thermal stress, good step
coverage, and can be applied to many substrate types and many substrate
sizes. Accordingly, the encapsulating layer thus deposited provides good
device lifetime for various display devices, such as OLED devices. In
another aspect, a method of depositing an amorphous carbon material on a
substrate at low temperature is provided. The amorphous carbon material
can be used to reduce thermal stress and prevent the deposited thin film
from peeling off the substrate.