Methods of creating a power distribution arrangement with tapered metal
wires for a physical design are provided and described. In one
embodiment, a method of creating a power distribution arrangement for a
physical design of an integrated circuit includes arranging a plurality
of metal wires for power distribution in a desired arrangement. Each
metal wire has a width. Furthermore, the metal wires are tapered such
that the width is thicker in a core edge area of the physical design than
in a core center area of the physical design. In other embodiments, a
method of creating a power distribution arrangement for a physical design
of a current integrated circuit includes arranging a plurality of metal
wires for power distribution in a desired arrangement. The metal wires
are tapered using a routing congestion profile and/or a voltage drop
profile of a prior physical design of a prior integrated circuit.