A cooling element for heat dissipation in one or more electronic components includes a metal element with one or more slit-shaped receiving openings for one or more electronic components that are to be cooled. In its lengthwise extension, each receiving opening has a receiving bore that holds a helical spring and that runs parallel to the lengthwise extension. The receiving bore is arranged in such a way that it is open on the lengthwise side towards the receiving opening and the spring placed in it projects with a radial partial section into the receiving opening that holds the electronic component. As a result, in partial areas, the spring presses the electronic component against the inner wall of the receiving opening that lies opposite from the spring, thus establishing thermal contact.