By using a high viscosity moisture-curable adhesive composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl (meth)acrylate monomer unit(s) and (D) an epoxy resin, it becomes possible to bond an adherend to a substrate without open time and without temporary tacking after application.