A control system for a manufacturing process includes an inspection tool inspecting a dislocation image in semiconductor substrate processed by manufacturing processes; an inspection information input module configured to acquire the inspected dislocation image; a process condition input module acquiring process conditions of the manufacturing processes; a structure information input module acquiring structure of the semiconductor substrate processed by target manufacturing process; a stress analysis module calculating stresses at nodes provided in the structure, based on target process condition and the structure; an origin setting module providing origins at positions where stress concentration having stress value not less than reference value is predicted; a dislocation dynamics analysis module calculating dislocation pattern in stress field for each position of the origins; and a dislocation pattern comparison module comparing the dislocation pattern with the inspected dislocation image so as to determine whether the target manufacturing process is critical manufacturing process.