A semiconductor package comprising a substrate having opposed top and bottom surfaces and a conductive pattern formed thereon. Disposed on the top surface of the substrate is a semiconductor die which is electrically connected to the conductive pattern. Also disposed on the top surface of the substrate is a leadframe which is electrically connected to the conductive pattern as well. A package body encapsulates the semiconductor die and partially encapsulates the leadframe such that a portion of the leadframe is exposed in one exterior surface of the package body, thus allowing a second semiconductor package to be stacked upon and electrically connected to the semiconductor package.