A structure for cooling an electronic device. The structure includes a first layer disposed over the electronic device for providing a heat path from the electronic device and a bottom layer including a fin structure and a lower surface opposite the fin structure, wherein the lower surface contacts the first layer. The structure further includes a liquid layer disposed over the fin structure of the bottom layer and a top layer including a fin structure and a top surface opposite the fin structure, wherein the fin structure of the top layer contacts the liquid layer. The structure further includes a heat sink in contact with or integral with the top layer.