The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material (2) is formed in such a manner as to superimpose ends (2b) on alignment marks (15) formed on the surface of a first substrate (6a), an anisotropic conductive material is formed in such a manner as to superimpose ends 3b on alignment marks (16) formed on the surface of a second substrate (6b), and the sealing material 2 and the anisotropic conductive material (3) are joined by bonding the first substrate (6a) and the second substrate (6b) to form one-piece sealing section (4).