A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.