A magnetic head having a heat sink structure that is disposed proximate the induction coil to draw heat away from sensitive components of the head. The heat sink is fabricated above the second magnetic pole, and is therefore fabricated subsequent to the fabrication of the more delicate components of the magnetic head. In a preferred embodiment, the heat sink is fabricated photolithographically in the same process steps in which the electrical lead to the center tap of the induction coil is fabricated. The only difference in the magnetic head fabrication process is the modification of the photolithographic mask that is used to create the electroplating trench in which the electrical lead is electroplated, and the change to the mask involves the creation of a second opening within the mask for the creation of an electroplating trench at the location of the heat sink.