The electronic device (100) is a chip-on-chip construction on a lead frame
(10) comprising a heat sink (13) in an encapsulation (80). The first chip
(20) and the second chip (30) are mutually connected by first conductive
interconnections (24) and the first chip (20) is connected to the lead
frame (10) by second conductive interconnections (27) which preferably
have a lower reflow temperature than the first conductive
interconnections (24). By heating the device (100) the adhesive layer
(25) will first shrink, causing a stress, which will be relaxated by
reflowing the second conductive interconnections (27).