The width of a current pass region of a semiconductor laser device is narrowed as much as possible, thus implementing a stable single transverse mode. The device is relatively resistant against physical impact. The device includes a semiconductor substrate having first and second opposite surfaces, and, in order, a first conductive type clad, active layer, etch stop layer, current blocking layer formed in a V-groove shape so that a part of the etch stop layer is exposed, second conductive type clad formed entirely over the entire of the V-groove and the current blocking layer, optical guide layer, current pass facilitation layer, cap layer, second conductive type electrode, and a first conductive type electrode formed on the second surface of the semiconductor substrate.