An electrode assembly for an elongated implantable lead containing conducting filars. The electrode assembly has a first support hull surrounding a portion of the lead. The electrode assembly also has an electrode hull for at least partially surrounding the support hull and a portion of the lead adjacent to the support hull. The electrode hull secures to the support hull and to the lead at a location axially spaced from the support hull, such that the electrode hull, the support hull, and the lead define a gap. The gap allows the conducting filars to operatively connect to the first support hull.