A light emitting assembly includes a metal substrate for dissipating heat
from the assembly. The metal substrate includes an electrically
insulating layer or coating on at least one side. Circuit traces are
applied to the electrically insulating layer using either thick or thin
film techniques. At least the ends of the circuit traces include a
metallic section to which leads of light emitting elements are soldered
or wire-bonded. A metallic section is provided adjacent the light
emitting element to transfer heat to the underlying substrate and/or to
reflect light from the element away from the substrate. A clear finish
retards tarnishing of the reflecting metallic section.