In accordance with the invention, there is a method of fabricating a material for transmission electron microscopy comprising removing a first portion from a material having a thickness of (d.sub.1) to form a thinned material having a thickness of (d.sub.2), contacting the thinned material to a sacrificial layer having a thickness of (s.sub.1), and removing a second portion from the thinned material so the thinned material has a thickness of (d.sub.3), wherein (d.sub.3)<(d.sub.2).

 
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> Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier

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