An electroluminescent panel includes a release layer, a first insulating layer on the release layer, a plurality of lamp layers on the first insulating layer, and a second insulating layer overlying the lamp layers. In accordance with one aspect of the invention, the first insulating layer and the second insulating layer include low molecular weight PVDF/HFP resin. In accordance with another aspect of the invention, at least one of the lamp layers includes a UV-cured resin and the remaining lamp layers include a heat-cured resin.

 
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> Metal seal packaging for organic light emitting diode device

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