A heatsink assembly is disclosed that includes a holder slidably engaging a circuit board component to be cooled and a heatsink secured to the heatsink holder. A method of cooling a circuit board component is also disclosed that involves the steps of providing a bracket having a central portion and first and second end portions directed toward one another, sliding the bracket over a portion of a circuit board component to be cooled such that the central portion faces a first surface of the circuit board component and the first and second end portions face opposing edges of the circuit board component, providing a heatsink, and securing the heatsink to the bracket in a manner that retains the heatsink and bracket on the circuit board component.