Products and assemblies are provided for socketably receiving elongate
interconnection elements, such as spring contact elements, extending from
electronic components, such as semiconductor devices. Socket substrates
are provided with capture pads for receiving ends of elongate
interconnection elements extending from electronic components. Various
capture pad configurations are disclosed. Connections to external devices
are provided via conductive traces adjacent the surface of the socket
substrate. The socket substrate may be supported by a support substrate.
In a particularly preferred embodiment the capture pads are formed
directly on a primary substrate such as a printed circuit board.