A high speed optoelectronic subassembly in an optoelectronic package is
disclosed that includes a dielectric support having a first electrical
trace on a surface thereof and a dielectric member mounted on the surface
of the support having a second electrical trace thereon. The support
extends laterally a distance greater than the member to form a shelf. A
dielectric step is positioned on the shelf abutting an end of the member
and a laser is positioned on the shelf adjacent the step so as to be
light accessible external to the subassembly. The laser and the step have
surfaces equal in height and cooperate to provide a mounting platform. A
resistive element is positioned on the mounting platform and electrically
connected to the laser, the resistive element and laser being
electrically externally accessible through the traces.