An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation component disposed between the main body and the resilient component, connected with the resilient component and covering the surface of the apertures. When the temperature of the electronic apparatus is increased, the resilient component expands and bends outward so as to carry the insulation component apart from the surface of the apertures and further form a space, thereby enabling air to flow through the apertures of the electronic apparatus and the space to dissipate heat of the electronic apparatus.