A semiconductor chip for flip chip bonding, a mounting structure for the semiconductor chip, and methods for forming a semiconductor chip for flip chip bonding and for fabricating a printed circuit board for a mounting structure of a semiconductor chip are provided which may improve connection between a solder bump of the semiconductor chip and a substrate of the printed circuit board without having to use an underfill material. A polymer core of the solder bump may be supported between a 3-dimensional UBM and a 3-dimensional top surface metallurgy, so as to establish connection strength of the solder bump without using underfill material, and to absorb the stresses which may concentrate on the solder bump due to the difference in coefficients of thermal expansion between metals.