A wafer flow recipe is prepared. Based on this wafer flow recipe, there are estimated and calculated respectively a PCD time from a time point at which a process for coating a resist liquid on a substrate by a coating unit has been terminated to a time point at which a first heating process is started at a first heating unit, a PAD time from a time point at which the first heating process has been terminated at the first heating unit to a time point at which an exposure process is started, and a PED time from a time point at which the exposure has been terminated to a time point at which a second heating process is started at a second heating unit. Then, these estimated times are displayed.