A bimetal saw band which is suitable for cutting materials of high hardness and wear resistance at high cutting speeds and with a reduced consumption of coolant is disclosed. The saw band includes a support band with from 0.20 to 0.45% of carbon, from 0.2 to 0.6% of silicon, from 0.5 to 1.8% of manganese, from 0.1 to 3.5% of molybdenum, from 1.0 to 5.0% of chromium, from 0.5 to 1.5% of nickel, from 0.1 to 1.0% of copper, from 0.1 to 2.0% of tungsten, from 0.1 to 0.5% of vanadium, from 0.01 to 0.30% of niobium and/or tantalum and less than 0.2% of cobalt, and the remainder iron including melting-related impurities, with the tungsten, vanadium and niobium/tantalum contents matched to one another. The saw includes hardmetal tips including at least 75% of tungsten carbide and 5 to 15% of cobalt, as well as grain stabilizers with a grain size of less than 5 .mu.m.