A semiconductor device includes: a semiconductor chip; a first metal plate
disposed on one side of the chip through a first solder layer; a second
metal plate disposed on the other side of the chip through a second
solder layer; a third metal plate disposed on the second metal plate
through a third solder layer; supporting means for holding at least one
of distances between the chip and the first metal plate and between the
chip and the second metal plate; and excess solder accommodation means
for accommodating excess solder in a case where the third solder layer
includes the excess solder.