An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.