Disclosed is a fluoroelastomer loaded with an inorganic filler which is coupled to the fluoroelastomer by a titanate, zirconate or aluminate for use as a base layer and/or a release layer on a fuser, transfix, receiver or rheological transfer member in a copy machine. The coupled filler bonds tightly to the fluorocarbon matrix, significantly decreasing the wear rate of the member. These fillers also significantly increase the thermal conductivity of the compound as is often desirable in fusing applications.

 
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> Pixel circuitry for imaging system

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