A semi-conductor handling equipment cleaning method and apparatus are configured for use with wafer carriers. The cleaning apparatus comprises a base portion having first and second apertures and configured to support the wafer carrier in sealing contact about the first aperture. A first fluidic circuit introduces a first cleaning fluid to the inner surface of the carrier and a second fluidic circuit introduces a second cleaning fluid to the outer surface of the carrier. The carrier forms a barrier with the base so that the cleaning media is isolated so as to substantially prevent the second fluid from communicating with the first fluid. An optional door cleaning assembly comprises a rotational housing, a shaft disposed in the housing and a door receiving assembly rotatably disposed on the shaft and within the housing and securably receives the door and forms a fluid-tight seal between the door and the door receiving assembly.