A photosensitive resin composition comprising: (d) at least one polybenzoxazole precursor polymer (e) at least one compound having structure VI V.sup.1--Y--V.sup.2 VI wherein Y is selected from S, O, NR.sup.2, (HOCH).sub.p, and ##STR00001## each R.sup.1 is selected H, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group or a halogen, each R.sup.2 is selected from H, SH, CH.sub.3, C.sub.2H.sub.5, and a linear or branched C.sub.1 C.sub.4 alkyl group containing a thiol group; p is an integer of from 1 to 4, and wherein V.sup.1 and V.sup.2 are independently selected from the group consisting of ##STR00002## wherein, m is independently an integer from 0 to 4 with the proviso that m=0 only when Y= ##STR00003## n is an integer from 1 to 5; and each R.sup.1 is defined as above; and (f) at least one solvent; wherein the amount of the compound of Structure VI present is an amount effective to inhibit residue from forming when the composition is coated on a substrate and the substrate is subsequently processed to form an image, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety on the polymer, then (d) at least one photoactive compound is also present in the composition.